After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known as Rapidus Chiplet ...

POCATELLO, Idaho, Sept. 16, 2025 /PRNewswire/ -- LA Semiconductor LLC ("LA Semiconductor" or "the Company"), a US-owned, fully operational pure-play semiconductor foundry for analog, digital and mixed ...

Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first venture ...

The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...

ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

Tokyo, Japan, December 9, 2025-- FUJIFILM Corporation announced the launch of “ZEMATES™*1,” a new brand of photosensitive insulating materials for semiconductor back-end processes, centered on ...

Expands applications' reach to backend semiconductor and Wafer Level Packaging, including Advanced Packaging. All-cash transaction valued at approximately $60 million. Acquisition expected to be ...