Abstract: A novel two-step iterative optimization method could be used in microwave and mm-wave bands for optimal topology of 2-D sparse multiple-input multiple-output (MIMO) arrays, and an improved ...
Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
During the holidays, I love spending time in the kitchen, using all my favorite devices to bake cookies and other treats that remind me of past Christmas celebrations. With a stand mixer, food ...
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