Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI ...

Cadence Design Systems (CDNS) recently announced a Chiplet Spec-to-Packaged Parts ecosystem, aimed at simplifying chiplet ...

Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market ...

Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...

CDNS unveils the first LPDDR5X 9600Mbps enterprise memory IP with Microsoft, bringing DDR5-class reliability to low-power ...

Cadence unveils a spec-driven chiplet ecosystem with Arm and Samsung Foundry, aiming to cut integration risk and speed AI, ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...

At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data ...

Baya Systems expands its Bengaluru hub to enhance AI and HPC innovation, aiming for over 100 engineers by 2026.

That's a lot of capital letters to say that Dell has engineering samples of a 16-inch "Premium" laptop with an OLED like the ...

At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the ...