Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI ...

Cadence Design Systems (CDNS) recently announced a Chiplet Spec-to-Packaged Parts ecosystem, aimed at simplifying chiplet ...

Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...

CDNS unveils the first LPDDR5X 9600Mbps enterprise memory IP with Microsoft, bringing DDR5-class reliability to low-power ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...

Baya Systems expands its Bengaluru hub to enhance AI and HPC innovation, aiming for over 100 engineers by 2026.

That's a lot of capital letters to say that Dell has engineering samples of a 16-inch "Premium" laptop with an OLED like the ...

At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the ...

Baya Systems, a leader in high-performance semiconductor system technologies, has announced the expansion of its engineering ...

The headline model, the TUF Gaming A14 FA401GM, pairs AMD’s new Ryzen AI 9 465 processor with NVIDIA’s GeForce RTX 5060 ...

ASUS unveils the TUF Gaming A14 at CES 2026, featuring Ryzen AI processors, RTX 5060 graphics, a 14-inch 165Hz 2.5K display, and a lightweight design focused on portable gaming performance.