Chiplet Summit today opened pre-registration for its fourth annual event, taking place February 17-19 at the Santa Clara Convention Center. Major chipmakers have all adopted chiplets for leading-edge ...
NewPhotonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, today introduced NPC50503 1.6T NPO ...
Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market ...
ZME Science on MSN
A Tiny Chip Placed Beneath AI Processors Could Cut Data Center Power Use by 50 percent
Those fancy graphics processors humming away in a modern data center look efficient on paper. A top-of-the-line product might ...
At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data ...
For decades, monolithic system-on-chip (“SoC”) designs defined the semiconductor landscape. Introduced in the 1970s[1] and refined over several generations, SoCs allowed designers to integrate ...
Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...
Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, ...
A lithography strategy that combines ultra-large exposure field and fine-resolution imaging with algorithmic early zone ...
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