The Politecnico di Milano has created the first integrated and fully tunable device based on spin waves, opening up new ...
The new M23 hybrid device connectors for wave soldering processes come as a space-saving 3-in-1 solution. They enable the ...
Abstract: More and more high-end microelectronic devices are being packaged by using solder bumps as the method of interconnection. The two main technologies used are flipchip in package (FCiP) and ...
Kamstrup, a Danish manufacturer of smart water meters, is using selective soldering equipment from Nordson Electronics ...
To ensure full confidence in the investment, Kamstrup conducted a production‑scale evaluation at Nordson Electronics Solutions’ Valkenswaard, Netherlands facility, where hundreds of its PCBs were ...
Kamstrup’s production team wanted to transition from traditional wave soldering to selective soldering to enhance automation ...