AMAT aims to double its HBM business from $1.5 billion to $3 billion, leaning on hybrid bonding leadership and its Kinex ...

Learn more about whether Kulicke and Soffa Industries, Inc. or Veeco Instruments Inc. is a better investment based on AAII's A+ Investor grades, which compare both companies' key financial metrics.

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

The British International Investment (BII), has committed US$20 million to Vietnamese lender HDBank's inaugural green bond ...

"Driven by AI accelerators, automotive ECUs, and edge computing, the global semiconductor silicon wafer market sees rising ...

Fraunhofer's innovative mobile gas chromatography system allows quick detection of volatile organic compounds, crucial for ...

Crystalline quartz films grown on four-inch silicon wafers detect Chikungunya virus at sensitivities surpassing standard ...

Recently, a research team led by Academician Lijun Wang at CIOMP under UCAS has systematically reviewed the latest advancements in transfer printing (TP) technology. The team detailed its practical ...

The decision could potentially release those subject to mandatory detention. A federal judge has struck down a Department of Homeland Security policy implemented in July that forced most immigrants ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

Abstract: While direct placement die-to-wafer (D2W) hybrid bonding is essential for advanced packaging, its performance is often compromised by an extended storage time between surface activation and ...

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...