Siemens PAVE360 Automotive, a cloud-based digital twin platform, offers automakers a jump-start in adopting software-defined ...

Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI ...

Delivers a fully integrated, system-level digital twin that speeds up development of ADAS, autonomous driving, and in-vehicle ...

Qualcomm has made a range of announcements at CES 2026, and notably introduced the Dragonwing Q‑7790 and Q‑8750 processors ...

The CISA KEV catalog was expanded with 245 vulnerabilities in 2025, including 24 flaws exploited by ransomware groups.

The next frontier in automotive AI is about equipping vehicles to learn, adapt and evolve through orchestrated data that ...

Brushless motors depend on high-strength magnets, and magnets depend on rare-earth supply chains that are still heavily ...

At CES 2026, Nvidia Corp. Chief Executive Jensen Huang once again reset the economics of artificial intelligence factories.

Broadcom has introduced the BCM4918 network processor for high-end Wi-Fi 8 residential access points, reviving the ...

Ventiva®, a leader in thermal solutions, today announced it is showcasing two new laptop reference designs with Compal at CES 2026. These new designs, which are built around Ventiva's ionic ...

Edge devices across multiple applications share common attack vectors. Security functionality must be designed in from the ...

Cadence today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, ...