Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Research Institute for Frontier Science, Beihang University, 100191 Beijing, People’s Republic of China Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics ...
Abstract: The classical sparsity-based source identification method encounters the basis mismatch problem due to discretizing the focus region and assuming that acoustic sources are on-grid. This ...
Accelerate your tech game Paid Content How the New Space Race Will Drive Innovation How the metaverse will change the future of work and society Managing the ...
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