Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Abstract: The rapid advancement of battery management systems (BMS) in automotive applications demands real-time, automated data acquisition, and visualization architectures capable of handling ...
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