Troops must have a waist measurement close to or less than half their height or risk being placed in their service's remedial ...
Abstract: The coplanarity of the bump height is the guarantee of packaging quality. Optical triangulation is a widely used method to measure the bump height. However, it is not easy to accurately ...
Abstract: Micro-cracks are prefabricated on the surface of the silicon wafer, and laser thermal cracking is used to dice the silicon wafer, which can greatly reduce the surface roughness of the cross ...
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