The U.S. Die-to-Die IP market was valued at USD 0.51 billion in 2025E and is projected to reach USD 1.02 billion by 2033, growing at a CAGR of 9.17% during 2026–2033. Market growth is driven by strong ...
Baya Systems, a leader in high-performance semiconductor system technologies, has announced the expansion of its engineering ...
CDNS unveils the first LPDDR5X 9600Mbps enterprise memory IP with Microsoft, bringing DDR5-class reliability to low-power ...
Built on LPDDR5X DRAM technology, the new memory IP system solution enables enterprise RAS capabilities while maintaining PPA in a compact form factor. The solution supports up to 9600Mbps data rates ...
The chipmaker has secured hybrid PCIe/CXL switching silicon to build a comprehensive scale-up platform for next-generation data centres.
Chiplet Summit today opened pre-registration for its fourth annual event, taking place February 17-19 at the Santa Clara Convention Center. Major chipmakers have all adopted chiplets for leading-edge ...
Marvell Technology, Inc.’s Celestial AI deal bets on photonic interconnects for multi-rack AI scale-up fabrics—unlocking a ...
That's a lot of capital letters to say that Dell has engineering samples of a 16-inch "Premium" laptop with an OLED like the ...
NewPhotonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, today introduced NPC50503 1.6T NPO ...
At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the ...
ASUS unveils the TUF Gaming A14 at CES 2026, featuring Ryzen AI processors, RTX 5060 graphics, a 14-inch 165Hz 2.5K display, and a lightweight design focused on portable gaming performance.
Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI ...
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