Cadence unveils a spec-driven chiplet ecosystem with Arm and Samsung Foundry, aiming to cut integration risk and speed AI, ...

Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market ...

At CES 2026, Cadence announced an ecosystem which delivers pre-validated (spec-to-packaged parts) for physical AI, data ...

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

According to post-CES details showing up online, it appears that AMD will not use the same chiplet design for its next-gen APUs, keeping the chiplet design for its 2nd generation EPYC and 3rd ...

A fresh batch of rumors suggest that AMD is currently in the early design phase of the RDNA 3 architecture, and it could represent the most radical change of GPU design ever. AMD could shift towards ...

One of the struggles of high core counts is communication between cores and outside the CPU. This problem is one that AMD has been grappling with since the launch of Zen. With up to 32 cores and now ...

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which ...

The performance and packaging advantages of chiplets have been fairly well documented, but there’s been a lag in creating some of the standards and development platforms needed to move the technology ...

What are chiplets? What is the Universal Chiplet Interconnect Express (UCIe)? Why UCIe matters. The idea behind chiplets and standardization isn’t new, but rather a logical progression in terms of ...