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Although electrical transmission over copper traces and wires has dominated the market for short-reach, high-speed data communication until now, it is probable that optical links will ultimately take ...
Abstract: Recently, advancing RF interconnect technologies for future 2.5D and 3D integration have been identified as an important game changer for energy efficient complex integrated circuit systems.
Abstract: Polyimide (PI) has been widely used as the insulator material in the Cu interconnect system for 3-D advanced packaging. In general, a barrier layer is required between PI and Cu to suppress ...