Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
Abstract: This paper presents a novel 3-dimensional coordinate transformed layer model (3D CTLM) for iron-core axial-flux permanent magnet synchronous motors (AFPMSMs). The proposed 3D CTLM initially ...
WORLD CUP fans have been promised a technological upgrade for this summer’s tournament. That will see a new 3D-enhanced ...
News Summary AMD introduces new Ryzen AI 400 and PRO 400 Series processors, delivering up to 60 NPU TOPS for Copilot+ PCs and AI experiences ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...
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