System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
This article is the second in a three-part series on the changes occurring in the Littoral Combat Ship community as the fleet rapidly grows, moves to a new crewing and organizational construct and ...
Testing Devices In Module Packages And Designing Cryogenic Current Sensors For All-Electric Aircraft
A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...
Traditional PV inspection methods using direct current polarisation have proved unreliable in detecting certain issues. Researchers from Enertis Applus+ detail a new approach to defect detection aimed ...
No automatic method exists to insert the different and multiple RLC package/PCB models of the Chip in Mix Mode (RTL + Spice) AMS verification. Such additions of components are inserted in simulation ...
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