The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

There is an expectation from consumers that today’s electronic products will just work and that electronic manufacturers have continued to improve the quality of their products. In most cases, this ...