Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

On-wafer probing techniques have become indispensable in the precise characterisation of semiconductor devices operating in the microwave and terahertz regions. These techniques enable the direct ...

Sheet resistance monitoring is essential for ion implant doping and anneal characterization. It’s also commonly used in processes such as ion implantation, metal deposition, diffusion, and epitaxial ...