As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

That’s where IC packaging comes in. It’s like the housing for your phone or the case for your computer – it does a lot more than just look pretty. We’re going to break down what IC packaging is all ...

Ever since Robert Widlar designed the µA702 in 1963, the first monolithic op-amp IC from Fairchild Semiconductor (followed by the venerable µA709 in 1965), IC op amps have largely kept pace with ...

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...