Adhesion won't be a problem, cohesion within the chip is a more important factor as chips aren't designed to withstand any forces in the direction a heatsink would apply. If the sink will fall off you ...
The EP21FL two-part epoxy-resin system features low to moderate viscosity and is suitable for potting, coating, and sealing electronic assemblies. It is said to excel at bonding dissimilar substrates ...
the EP30D-7 two component epoxy is serviceable over a wide temperature range of -100ºF to above +250ºF, EP30D-7. Capable of curing at room temperature or more rapidly at elevated temperatures with ...
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