The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
Multi-die systems are made up of several specialized functional dies (or chiplets) that are assembled in the same package to create the complete system. Multi-die systems have recently emerged as a ...
TOKYO, Dec. 09, 2024 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced an integrated test cell designed to maximize die-level test ...
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