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Chiplet Summit announces its fourth annual conference on February 17-19, 2026, at the Santa Clara Convention Center. The 2026 event will highlight the next wave of innovation in chiplet-based design ...

With the recent ratification of the Universal Chiplet Interconnect Express (UCIe) 3.0 standard in August 2025, the industry has finally established a "lingua franca" that allows chips from different ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

"Italy was chosen as the location for Silicon Box's first global expansion for several reasons, including its infrastructure, strong talent base and the government's initiative to support and ...