Chiplet Summit announces its fourth annual conference on February 17-19, 2026, at the Santa Clara Convention Center. The 2026 event will highlight the next wave of innovation in chiplet-based design ...

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With the recent ratification of the Universal Chiplet Interconnect Express (UCIe) 3.0 standard in August 2025, the industry has finally established a "lingua franca" that allows chips from different ...

The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to ...

Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

Company is leading the pack to bring affordable, high performance, power-optimized, scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centers, and ...

The rising costs of AI chips driven by advanced process technologies have continued to escalate, while the direct performance gains from these process improvements have significantly diminished.

"Italy was chosen as the location for Silicon Box's first global expansion for several reasons, including its infrastructure, strong talent base and the government's initiative to support and ...