Hsinchu, Taiwan – March 10, 2022 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ...
Plano, Texas, USA -- September 26, 2022-- Siemens Digital Industries Software today introduced the Tessent™ Multi-die software solution, which helps customers dramatically speed and simplify critical ...
A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...
Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip. But as Vidya Neerkundar, technical marketing engineer at Siemens EDA ...
2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback